NeuroNexus’ silicon array technology and its application are well-established through decades of development and use. Fabricated using methods applied in the semiconductor industry, NeuroNexus silicon probes are batch-processed, highly reproducible and have features defined to within +/- 1 micron. The devices are based on a silicon substrate whose thickness and shape is precisely defined using boron etch-stop micromachining. The substrate supports an array of polysilicon leads that are encapsulated above and below with inorganic dielectrics. The leads make contact to electrode sites (typically iridium) and bond pads through etched apertures in the upper dielectrics.

The boron doping process offers the ability to modulate substrate thickness on a given device.  Using this design feature, flexible ribbon cables can be integrated with probes for use in chronic preparations, and sharp tips can be formed that are capable of penetrating tough structures such as peripheral nerve.

The standard silicon probe thickness is 15 microns and a wide variety of designs are offered that vary in the number and configuration of electrode sites, as well as the number and configuration of shanks.  They can be ordered in a broad range of package configurations suitable for use in both acute and chronic preparations.  In addition to the standard 1D and 2D arrays, NeuroNexus is pleased to now offer 3D arrays of silicon probes.  A custom design, fabrication and packaging service is available to meet the needs of those investigators not served by catalog devices.